JPH01104040U - - Google Patents
Info
- Publication number
- JPH01104040U JPH01104040U JP19798187U JP19798187U JPH01104040U JP H01104040 U JPH01104040 U JP H01104040U JP 19798187 U JP19798187 U JP 19798187U JP 19798187 U JP19798187 U JP 19798187U JP H01104040 U JPH01104040 U JP H01104040U
- Authority
- JP
- Japan
- Prior art keywords
- package
- resin
- supporting piece
- resin mold
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19798187U JPH01104040U (en]) | 1987-12-26 | 1987-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19798187U JPH01104040U (en]) | 1987-12-26 | 1987-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104040U true JPH01104040U (en]) | 1989-07-13 |
Family
ID=31488509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19798187U Pending JPH01104040U (en]) | 1987-12-26 | 1987-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104040U (en]) |
-
1987
- 1987-12-26 JP JP19798187U patent/JPH01104040U/ja active Pending